They now use intrusive soldering that solders surface mount and through-hole components at the same time:
The idea behind intrusive soldering, also known as pin-in-paste soldering is simple: solder paste is printed onto or around a through-hole pad, and the through-hole component is passed into reflow with your SMD components. The molten solder paste then fills in the through-hole and attaches the component pin.
Same article was posted yesterday: https://lemmy.world/post/37318526