this post was submitted on 07 Mar 2026
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Oracle Layoffs: Tech giant to slash 30,000 jobs as banks pull out from financing AI data centres | Company Business News (www.livemint.com)
submitted 2 days ago by Deceptichum@quokk.au to c/technology@lemmy.world
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Over the past few weeks, several US banks have pulled off from lending to Oracle for expanding its AI data centres, as per a report.

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[โ€“] rumba@lemmy.zip 3 points 1 day ago* (last edited 5 hours ago) (1 children)

I don't actually buy it. It won't fit on memory modules as they are today, but in the end, it's just faster, higher density, prob has some extra features, but nothing you can't rework a motherboard or modules to support. of course, min quantity will be like 128GB :)

edit: looks like the most likely they'll just put stacks on the CPUs in a few years. Apple is already heading that way. AMD has some open patents to put HBM on CPUs

[โ€“] brucethemoose@lemmy.world 8 points 1 day ago* (last edited 1 day ago)

That's not true, unfortunately. It's not economical to transplant RAM ICs once they're packaged and soldered onto something.

And if they're produced as, say, HBM modules, they absolutely cannot be repurposed for, say, DDR5 or LPDDR5 CPUs, or GDDR GPUs. There's no reworking, the memory buses on processors simply do not support them electrically, and altering those processors would have a massive development cost with years of lead time.

Some of the RAM (like the LPDDR5X for the Nvidia Grace Hopper ARM CPUs) can be re-used, but it seems most is being made as HBM.